: | FDB8860 |
---|---|
: | RF Transistors |
: | onsemi |
: | N-Channel Logic |
: | - |
: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
: | YES |
TYPE | DESCRIPTION |
Manufacturer Part Number: | FDB8860 |
Brand Name: | ON Semiconductor |
Pbfree Code: | Yes |
Part Life Cycle Code: | Active |
Ihs Manufacturer: | ON SEMICONDUCTOR |
Package Description: | SMALL OUTLINE, R-PSSO-G2 |
Manufacturer Package Code: | 418AJ |
Reach Compliance Code: | not_compliant |
ECCN Code: | EAR99 |
HTS Code: | 8541.29.00.95 |
Factory Lead Time: | 1 Week |
Manufacturer: | ON Semiconductor |
Risk Rank: | 0.68 |
Samacsys Description: | FDB8860, N-channel MOSFET Transistor, 80 A 30 V, 3-Pin TO-263AB |
Avalanche Energy Rating (Eas): | 947 mJ |
Case Connection: | DRAIN |
Configuration: | SINGLE WITH BUILT-IN DIODE |
DS Breakdown Voltage-Min: | 30 V |
Drain Current-Max (Abs) (ID): | 80 A |
Drain Current-Max (ID): | 31 A |
Drain-source On Resistance-Max: | 0.0027 Ω |
FET Technology: | METAL-OXIDE SEMICONDUCTOR |
JEDEC-95 Code: | TO-263AB |
JESD-30 Code: | R-PSSO-G2 |
JESD-609 Code: | e3 |
Moisture Sensitivity Level: | 1 |
Number of Elements: | 1 |
Number of Terminals: | 2 |
Operating Mode: | ENHANCEMENT MODE |
Operating Temperature-Max: | 175 °C |
Package Body Material: | PLASTIC/EPOXY |
Package Shape: | RECTANGULAR |
Package Style: | SMALL OUTLINE |
Peak Reflow Temperature (Cel): | NOT SPECIFIED |
Polarity/Channel Type: | N-CHANNEL |
Power Dissipation-Max (Abs): | 306 W |
Qualification Status: | Not Qualified |
Subcategory: | FET General Purpose Power |
Surface Mount: | YES |
Terminal Finish: | Tin (Sn) |
Terminal Form: | GULL WING |
Terminal Position: | SINGLE |
[email protected] Reflow Temperature-Max (s): | NOT SPECIFIED |
Transistor Application: | SWITCHING |
Transistor Element Material: | SILICON |
1
3.3015
3.3015
10
3.139
31.39
100
2.9764
297.64
500
2.8038
1401.9
1000
2.6412
2641.2