| ： | SSM2315CBZ-REEL7 |
|---|---|
| ： | Audio ICs |
| ： | Analog Devices |
| ： | . The applicati |
| ： | - |
| ： | 9-WFBGA, WLCSP |
| ： | YES |
| TYPE | DESCRIPTION |
| Manufacturer Part Number: | SSM2315CBZ-REEL7 |
| Source Url Status Check Date: | 2013-05-01 14:56:54.763 |
| Brand Name: | Analog Devices Inc |
| Pbfree Code: | No |
| Rohs Code: | Yes |
| Part Life Cycle Code: | Active |
| Ihs Manufacturer: | ANALOG DEVICES INC |
| Part Package Code: | BGA |
| Package Description: | VFBGA, BGA9,3X3,20 |
| Pin Count: | 9 |
| Manufacturer Package Code: | CB-9-2 |
| Reach Compliance Code: | compliant |
| ECCN Code: | EAR99 |
| HTS Code: | 8542.31.00.01 |
| Manufacturer: | Analog Devices Inc |
| Risk Rank: | 0.8 |
| Bandwidth-Nom: | 20 kHz |
| Consumer IC Type: | AUDIO AMPLIFIER |
| Gain: | 6 dB |
| Harmonic Distortion: | 10% |
| JESD-30 Code: | S-PBGA-B9 |
| JESD-609 Code: | e1 |
| Length: | 1.5 mm |
| Moisture Sensitivity Level: | 1 |
| Number of Channels: | 1 |
| Number of Functions: | 1 |
| Number of Terminals: | 9 |
| Operating Temperature-Max: | 85 °C |
| Operating Temperature-Min: | -40 °C |
| Output Power-Nom: | 3 W |
| Package Body Material: | PLASTIC/EPOXY |
| Package Code: | VFBGA |
| Package Equivalence Code: | BGA9,3X3,20 |
| Package Shape: | SQUARE |
| Package Style: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel): | 260 |
| Power Supplies: | 5 V |
| Qualification Status: | Not Qualified |
| Seated Height-Max: | 0.655 mm |
| Subcategory: | Audio/Video Amplifiers |
| Supply Voltage-Max (Vsup): | 5.5 V |
| Supply Voltage-Min (Vsup): | 2.5 V |
| Surface Mount: | YES |
| Temperature Grade: | INDUSTRIAL |
| Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form: | BALL |
| Terminal Pitch: | 0.5 mm |
| Terminal Position: | BOTTOM |
| [email protected] Reflow Temperature-Max (s): | 30 |
| Width: | 1.5 mm |
1
2.4995
2.4995
10
2.377
23.77
100
2.2446
224.46
500
2.1221
1061.05
1000
1.9996
1999.6
