| ： | IS31AP2010B-UTLS2-TR |
|---|---|
| ： | 音频IC |
| ： | ISSI |
| ： | [email protect |
| ： | - |
| ： | <em class="rohs">Lead free / RoHS Compliant</em> |
| ： | YES |
| TYPE | DESCRIPTION |
| Manufacturer Part Number: | IS31AP2010B-UTLS2-TR |
| Rohs Code: | Yes |
| Part Life Cycle Code: | Active |
| Ihs Manufacturer: | INTEGRATED SILICON SOLUTION INC |
| Part Package Code: | QFN |
| Package Description: | UTQFN-9 |
| Pin Count: | 9 |
| Reach Compliance Code: | compliant |
| ECCN Code: | EAR99 |
| HTS Code: | 8542.33.00.01 |
| Factory Lead Time: | 6 Weeks |
| Manufacturer: | Integrated Silicon Solution Inc |
| Risk Rank: | 1.68 |
| Bandwidth-Nom: | 20 kHz |
| Consumer IC Type: | AUDIO AMPLIFIER |
| JESD-30 Code: | S-PBGA-B9 |
| Length: | 1.5 mm |
| Number of Channels: | 1 |
| Number of Functions: | 1 |
| Number of Terminals: | 9 |
| Operating Temperature-Max: | 85 °C |
| Operating Temperature-Min: | -40 °C |
| Output Power-Nom: | 3 W |
| Package Body Material: | PLASTIC/EPOXY |
| Package Code: | VFBGA |
| Package Equivalence Code: | LGA9,3X3,20 |
| Package Shape: | SQUARE |
| Package Style: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel): | NOT SPECIFIED |
| Power Supplies: | 3/5 V |
| Qualification Status: | Not Qualified |
| Seated Height-Max: | 0.6 mm |
| Subcategory: | Audio/Video Amplifiers |
| Supply Voltage-Max (Vsup): | 5.5 V |
| Supply Voltage-Min (Vsup): | 2.7 V |
| Surface Mount: | YES |
| Temperature Grade: | INDUSTRIAL |
| Terminal Form: | BALL |
| Terminal Pitch: | 0.5 mm |
| Terminal Position: | BOTTOM |
| [email protected] Reflow Temperature-Max (s): | NOT SPECIFIED |
| Width: | 1.5 mm |
1
0.7359
0.7359
10
0.6976
6.976
100
0.6593
65.93
500
0.621
310.5
1000
0.5827
582.7
