: | BAP70-03,115 |
---|---|
: | PIN Diodes |
: | NXP Semiconductors |
: | Standard:-; MSL |
: | - |
: | SOD-323 |
: | YES |
TYPE | DESCRIPTION |
Manufacturer Part Number: | BAP70-03,115 |
Brand Name: | NXP Semiconductor |
Rohs Code: | Yes |
Part Life Cycle Code: | End Of Life |
Ihs Manufacturer: | NXP SEMICONDUCTORS |
Part Package Code: | SOD |
Package Description: | PLASTIC, SC-76, 2 PIN |
Pin Count: | 2 |
Manufacturer Package Code: | SOD323 |
Reach Compliance Code: | compliant |
HTS Code: | 8541.10.00.70 |
Manufacturer: | NXP Semiconductors |
Risk Rank: | 5.52 |
Samacsys Description: | Silicon PIN diode |
Additional Feature: | HIGH VOLTAGE |
Application: | ATTENUATOR |
Breakdown Voltage-Min: | 50 V |
Configuration: | SINGLE |
Diode Capacitance-Max: | 0.25 pF |
Diode Capacitance-Nom: | 0.57 pF |
Diode Element Material: | SILICON |
Diode Forward Resistance-Max: | 1.9 Ω |
Diode Res Test Current: | 0.5 mA |
Diode Res Test Frequency: | 100 MHz |
Diode Type: | PIN DIODE |
JESD-30 Code: | R-PDSO-G2 |
JESD-609 Code: | e3 |
Minority Carrier Lifetime-Nom: | 1.25 µs |
Moisture Sensitivity Level: | 1 |
Number of Elements: | 1 |
Number of Terminals: | 2 |
Operating Temperature-Max: | 150 °C |
Operating Temperature-Min: | -65 °C |
Package Body Material: | PLASTIC/EPOXY |
Package Shape: | RECTANGULAR |
Package Style: | SMALL OUTLINE |
Peak Reflow Temperature (Cel): | 260 |
Power Dissipation-Max: | 0.5 W |
Qualification Status: | Not Qualified |
Subcategory: | PIN Diodes |
Surface Mount: | YES |
Technology: | POSITIVE-INTRINSIC-NEGATIVE |
Terminal Finish: | Tin (Sn) |
Terminal Form: | GULL WING |
Terminal Position: | DUAL |
[email protected] Reflow Temperature-Max (s): | NOT SPECIFIED |
1
0.179
0.179
10
0.1645
1.645
100
0.1601
16.01
500
0.1556
77.8
1000
0.1412
141.2