| ： | BAP50-03,115 |
|---|---|
| ： | PIN Diodes |
| ： | NXP Semiconductors |
| ： | RF Diode; Diode |
| ： | - |
| ： | SOD-323 |
| ： | YES |
| TYPE | DESCRIPTION |
| Manufacturer Part Number: | BAP50-03,115 |
| Brand Name: | NXP Semiconductor |
| Rohs Code: | Yes |
| Part Life Cycle Code: | Active |
| Ihs Manufacturer: | NXP SEMICONDUCTORS |
| Part Package Code: | SOD |
| Package Description: | R-PDSO-G2 |
| Pin Count: | 2 |
| Manufacturer Package Code: | SOD323 |
| Reach Compliance Code: | compliant |
| HTS Code: | 8541.10.00.70 |
| Manufacturer: | NXP Semiconductors |
| Risk Rank: | 0.63 |
| Breakdown Voltage-Min: | 50 V |
| Configuration: | SINGLE |
| Diode Capacitance-Max: | 0.55 pF |
| Diode Capacitance-Nom: | 0.55 pF |
| Diode Element Material: | SILICON |
| Diode Forward Resistance-Max: | 5 Ω |
| Diode Res Test Current: | 0.5 mA |
| Diode Res Test Frequency: | 100 MHz |
| Diode Type: | PIN DIODE |
| JESD-30 Code: | R-PDSO-G2 |
| JESD-609 Code: | e3 |
| Moisture Sensitivity Level: | 1 |
| Number of Elements: | 1 |
| Number of Terminals: | 2 |
| Operating Temperature-Max: | 150 °C |
| Operating Temperature-Min: | -65 °C |
| Package Body Material: | PLASTIC/EPOXY |
| Package Shape: | RECTANGULAR |
| Package Style: | SMALL OUTLINE |
| Peak Reflow Temperature (Cel): | 260 |
| Power Dissipation-Max: | 0.5 W |
| Qualification Status: | Not Qualified |
| Reverse Test Voltage: | 1 V |
| Subcategory: | PIN Diodes |
| Surface Mount: | YES |
| Technology: | POSITIVE-INTRINSIC-NEGATIVE |
| Terminal Finish: | Tin (Sn) |
| Terminal Form: | GULL WING |
| Terminal Position: | DUAL |
| [email protected] Reflow Temperature-Max (s): | NOT SPECIFIED |
1
0.06
0.06
10
0.0585
0.585
100
0.057
5.7
500
0.0555
27.75
1000
0.044
44
