| ： | 10M04SAE144C8G |
|---|---|
| ： | Programmable Logic ICs |
| ： | Intel |
| ： | FPGA MAX 10 Fam |
| ： | - |
| ： | 144-EQFP (20x20) |
| ： | YES |
| TYPE | DESCRIPTION |
| Manufacturer Part Number: | 10M04SAE144C8G |
| Rohs Code: | Yes |
| Part Life Cycle Code: | Active |
| Ihs Manufacturer: | INTEL CORP |
| Package Description: | HLFQFP, QFP144,.87SQ,20 |
| Reach Compliance Code: | compliant |
| HTS Code: | 8542.39.00.01 |
| Manufacturer: | Intel Corporation |
| Risk Rank: | 1.52 |
| Samacsys Description: | FPGA - Field Programmable Gate Array |
| Additional Feature: | OPERATES AT 3.3V NOMINAL VCC |
| Clock Frequency-Max: | 402 MHz |
| JESD-30 Code: | S-PQFP-G144 |
| Length: | 20 mm |
| Moisture Sensitivity Level: | 3 |
| Number of CLBs: | 250 |
| Number of Inputs: | 101 |
| Number of Logic Cells: | 4000 |
| Number of Outputs: | 101 |
| Number of Terminals: | 144 |
| Operating Temperature-Max: | 85 °C |
| Organization: | 250 CLBS |
| Package Body Material: | PLASTIC/EPOXY |
| Package Code: | HLFQFP |
| Package Equivalence Code: | QFP144,.87SQ,20 |
| Package Shape: | SQUARE |
| Package Style: | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel): | NOT SPECIFIED |
| Programmable Logic Type: | FIELD PROGRAMMABLE GATE ARRAY |
| Seated Height-Max: | 1.65 mm |
| Supply Voltage-Max: | 3.15 V |
| Supply Voltage-Min: | 2.85 V |
| Supply Voltage-Nom: | 3 V |
| Surface Mount: | YES |
| Temperature Grade: | OTHER |
| Terminal Form: | GULL WING |
| Terminal Pitch: | 0.5 mm |
| Terminal Position: | QUAD |
| [email protected] Reflow Temperature-Max (s): | NOT SPECIFIED |
| Width: | 20 mm |
1
35.245
35.245
10
33.4838
334.838
100
31.7225
3172.25
500
29.9613
14980.65
1000
28.2
28200
