| ： | GD25LQ64CQIGR |
|---|---|
| ： | 记忆 |
| ： | GigaDevice |
| ： | 64Mb SPI NOR Fl |
| ： | - |
| ： | 8-USON (4x4) |
| ： | YES |
| TYPE | DESCRIPTION |
| Manufacturer Part Number: | GD25LQ64CQIGR |
| Rohs Code: | Yes |
| Part Life Cycle Code: | Contact Manufacturer |
| Ihs Manufacturer: | GIGADEVICE SEMICONDUCTOR INC |
| Package Description: | USON-8 |
| Reach Compliance Code: | unknown |
| ECCN Code: | 3A991.B.1.A |
| HTS Code: | 8542.32.00.51 |
| Manufacturer: | GigaDevice Semiconductor (Beijing) Inc |
| Risk Rank: | 5.76 |
| Clock Frequency-Max (fCLK): | 133 MHz |
| JESD-30 Code: | S-PDSO-N8 |
| Length: | 4 mm |
| Memory Density: | 67108864 bit |
| Memory IC Type: | FLASH |
| Memory Width: | 1 |
| Number of Functions: | 1 |
| Number of Terminals: | 8 |
| Number of Words: | 67108864 words |
| Number of Words Code: | 64000000 |
| Operating Mode: | SYNCHRONOUS |
| Operating Temperature-Max: | 85 °C |
| Operating Temperature-Min: | -40 °C |
| Organization: | 64MX1 |
| Package Body Material: | PLASTIC/EPOXY |
| Package Code: | HVSON |
| Package Shape: | SQUARE |
| Package Style: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Parallel/Serial: | SERIAL |
| Peak Reflow Temperature (Cel): | NOT SPECIFIED |
| Programming Voltage: | 1.8 V |
| Seated Height-Max: | 0.5 mm |
| Supply Voltage-Max (Vsup): | 2 V |
| Supply Voltage-Min (Vsup): | 1.65 V |
| Supply Voltage-Nom (Vsup): | 1.8 V |
| Surface Mount: | YES |
| Technology: | CMOS |
| Temperature Grade: | INDUSTRIAL |
| Terminal Form: | NO LEAD |
| Terminal Pitch: | 0.8 mm |
| Terminal Position: | DUAL |
| [email protected] Reflow Temperature-Max (s): | NOT SPECIFIED |
| Type: | NOR TYPE |
| Width: | 4 mm |
1
market price
-
10
market price
-
100
market price
-
500
market price
-
1000
market price
-
