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kingston memory 颗粒解析（eMCP/ ePOP /DRAM/eMMC）

Date:2024/09/13 Category:Information Browse:644


eMCP based on LPDDR3

P/N	Storage capacity		Stand		package	FBGA	Temperature
	NAND	DRAM	eMMC	DRAM	(mm)
	(GB)	(Gb)	eMMC	DRAM	(mm)
04EM04-N3GM627	4	4	5	LPDDR3	11.5x13.0x1.0	221	-25°C ~ +85°C
08EM08-N3GML36	8	8	5.1	LPDDR3	11.5x13.0x1.0	221	-25°C ~ +85°C
16EM08-N3GTB29	16	8	5.1	LPDDR3	11.5x13.0x1.0	221	-25°C ~ +85°C
16EM16-N3GTB29	16	16	5.1	LPDDR3	11.5x13.0x1.0	221	-25°C ~ +85°C
32EM16-N3GTX29	32	16	5.1	LPDDR3	11.5x13.0x1.0	221	-25°C ~ +85°C
32EM32-N3HTX29	32	32	5.1	LPDDR3	11.5x13.0x1.1	221	-25°C ~ +85°C
64EM32-N3HTX29	64	32	5.1	LPDDR3	11.5x13.0x1.1	221	-25°C ~ +85°C

eMCP based on LPDDR4
P/N	Capacity		Stand		Package	FBGA	Temperature
	NAND	DRAM	eMMC	DRAM	(mm)
	(GB)	(Gb)	eMMC	DRAM	(mm)
04EM08-M4EM627	4	8	5.1	LPDDR4x	8x9.5x0.8	149	-25°C ~ +85°C
16EM16-M4CTB29	16	16	5.1	LPDDR4x	11.5x13.0x1.0	254	-25°C ~ +85°C
32EM16-M4CTX29	32	16	5.1	LPDDR4x	11.5x13.0x1.0	254	-25°C ~ +85°C
32EM32-M4DTX29	32	32	5.1	LPDDR4x	11.5x13.0x1.0	254	-25°C ~ +85°C
64EM32-M4DTX29	64	32	5.1	LPDDR4x	11.5x13.0x1.0	254	-25°C ~ +85°C
128EM32-M4DTX29	128	32	5.1	LPDDR4x	11.5x13.0x1.1	254	-25°C ~ +85°C

ePoP based on LPDDR3

P/N	Capacity		Stand		Package	FBGA	Temperature
	NAND	DRAM	eMMC	DRAM	(mm)
	(GB)	(Gb)	eMMC	DRAM	(mm)
04EP04-N3GM627	4	4	5	LPDDR3	10x10x0.8	136	-25°C ~ +85°C
04EP08-N3GM627	4	8	5	LPDDR3	10x10x0.85	136	-25°C ~ +85°C
08EP08-N3GTC32*	8	8	5.1	LPDDR3	10x10x0.85	136	-25°C ~ +85°C
32EP08-N3GTC32	32	8	5.1	LPDDR3	10x10x0.85	136	-25°C ~ +85°C

ePoP based on LPDDR4x

P/N	Capacity		Stand		Package	FBGA	Temperature
	NAND	DRAM	eMMC	DRAM	(mm)
	(GB)	(Gb)	eMMC	DRAM	(mm)
08EP08-M4ETC32*	8	8	5.1	LPDDR4x	8x9.5x0.8	144	-25°C ~ +85°C
08CP08-M4ETC32*	8	8	5.1	LPDDR4x	8x9.5x0.85	144	-25°C ~ +85°C
16EP08-M4ETC32	16	8	5.1	LPDDR4x	8x9.5x0.8	144	-25°C ~ +85°C
32EP08-M4ETC32	32	8	5.1	LPDDR4x	8x9.5x0.8	144	-25°C ~ +85°C
16EP16-M4FTC32	16	16	5.1	LPDDR4x	8x9.5x0.8	144	-25°C ~ +85°C
32EP16-M4FTC32	32	16	5.1	LPDDR4x	8x9.5x0.8	144	-25°C ~ +85°C
32CP16-M4FTC32	32	16	5.1	LPDDR4x	8x9.5x0.85	144	-25°C ~ +85°C

DDR3/DDR3L Commercial

P/N	Capacity	Description	Package	VDD, VDDQ	Temperature
D1216ECMDXGJD	2Gb	96 球 128Mx16 DDR3/3L 内存 1866Mbps	7.5x13.5x1.2	1.35V¹	0°C ~ +95°C
D2516ECMDXGJD	4Gb	96 球 256Mx16 DDR3/3L 内存 1866Mbps	7.5x13.5x1.2	1.35V¹	0°C ~ +95°C
D5128ECMDPGJD	4Gb	78 球 512Mx8 DDR3/3L 内存 1866Mbps	7.5x10.6x1.2	1.35V¹	0°C ~ +95°C
D2516ECMDXGME	4Gb	96 球 256Mx16 DDR3/3L 内存 2133Mbps	7.5x13.5x1.2	1.35V¹	0°C ~ +95°C
B5116ECMDXGJD	8Gb	96 球 512Mx16 DDR3/3L 内存 1866Mbps	9x13.5x1.2	1.35V¹	0°C ~ +95°C

DDR3/DDR3L Memory Industrial

P/n	Capacity	Description	Package	VDD, VDDQ	Temperature
D1216ECMDXGJDI	2Gb	96 球 128Mx16 DDR3/3L 内存 1866Mbps	7.5x13.5x1.2	1.35V¹	-40°C ~ +95°C
D2568ECMDPGJDI	2Gb	78 球 256Mx8 DDR3/3L 内存 1866Mbps	7.5x10.6x1.2	1.35V¹	-40°C ~ +95°C
D2516ECMDXGJDI	4Gb	96 球 256Mx16 DDR3/3L 内存 1866Mbps	7.5x13.5x1.2	1.35V¹	-40°C ~ +95°C
D5128ECMDPGJDI	4Gb	78 球 512Mx8 DDR3/3L 内存 1866Mbps	7.5x10.6x1.2	1.35V¹	-40°C ~ +95°C
D2516ECMDXGMEI	4Gb	96 球 256Mx16 DDR3/3L 内存 2133Mbps	7.5x13.5x1.2	1.35V¹	-40°C ~ +95°C
B5116ECMDXGJDI	8Gb	96 球 512Mx16 DDR3/3L 内存 1866Mbps	9x13.5x1.2	1.35V¹	-40°C ~ +95°C

DDR3/DDR3L FBGA Automotive Temp

P/N	Capacity	Package	package	VDD、 VDDQ	Temperature
D1216ECMDXGMEY	2Gb	96 ball 128Mx16 DDR3/3L 2133Mbps	13.5x7.5x1.2	1.35V¹	-40°C ~ +105°C
D2516ECMDXGMEY	4Gb	96 ball 256Mx16 DDR3/3L 2133Mbps	13.5x7.5x1.2	1.35V¹	-40°C ~ +105°C

DDR4 光纤光栅商用温度

P/N	Capacity	Description	Package	VDD, VDDQ	Temperature
D5116AN9CXGRK	8Gb	96 球 FBGA DDR4 C 型温度	7.5x13x1.2	1.2V	0°C ~ +95°C
D5116AN9CXGXN	8Gb	96 球 FBGA DDR4 C 型温度	7.5x13x1.2	1.2V	0°C ~ +95°C
D2516ACXGXGRK	4Gb	96 球 FBGA DDR4 C 型温度	7.5x13x1.2	1.2V	0°C ~ +95°C

DDR4 工业温度

P/N	Capacity	Description	Package	VDD, VDDQ	Temperature
D5116AN9CXGXNI	8Gb	96 球光纤光栅 DDR4 I 型温度 x16	7.5x13x1.2	1.2V	-40°C ~ +95°C
D1028AN9CPGXNI	8Gb	78 球光纤光栅 DDR4 I 型温度 x8	7.5x13x1.2	1.2V	-40°C ~ +95°C

LPDDR4 FBGA 光纤光栅商用温度

P/N	Capacity	Description	Package	VDD, VDDQ	Temperature
D0811PM2FDGUK	16Gb	200 球光纤光栅 LPDDR4 C 型温度	10x14.5x1.0	1.1V	-25°C ~ +85°C
B1621PM2FDGUK	16Gb	200 球光纤光栅 LPDDR4 C 型温度	10x14.5x1.0	1.1V	-25°C ~ +85°C

LPDDR4 FBGA 工业温度

P/N	Capacity	Description	Package	VDD, VDDQ	Temperature
D0811PM2FDGUKW	8Gb	200 球光纤光栅 LPDDR4 I 型温度	10x14.5x1.0	1.1V	-40°C ~ +95°C
B1621PM2FDGUKW	16Gb	200 球光纤光栅 LPDDR4 I 型温度	10x14.5x1.0	1.1V	-40°C ~ +95°C

eMMC P/N Spec

P/N	Capacity	eMMC Stand	eMMC Size	NAND
EMMC04G-MT32	4GB	5.1 (HS400)	11.5x13x0.8	MLC
EMMC04G-CT32	4GB	5.1 (HS400)	9.0x7.5x0.8	MLC
EMMC08G-MV28	8GB	5.1 (HS400)	11.5x13x0.8	MLC
EMMC08G-CT32	8GB	5.1 (HS400)	9.0x7.5x0.8	MLC
EMMC16G-MW28	16GB	5.1 (HS400)	11.5x13x0.9	MLC
EMMC32G-TX29	32GB	5.1 (HS400)	11.5x13x0.8	3D TLC
EMMC32G-KC30	32GB	5.1 (HS400)	8.0x8.5x0.9	3D TLC
EMMC64G-TY29	64GB	5.1 (HS400)	11.5x13x0.8	3D TLC
EMMC128-TY29	128GB	5.1 (HS400)	11.5x13x0.8	3D TLC
EMMC256-TY29	256GB	5.1 (HS400)	11.5x13x1.0	3D TLC

I-Temp eMMC
P/N	Capacity	eMMC Stand	Package Size	NAND	Temperature
EMMC04G-WT32	4GB	5.1 (HS400)	11.5x13x0.8	MLC	-40°C~+85°C
EMMC08G-WV28	8GB	5.1 (HS400)	11.5x13x0.8	MLC	-40°C~+85°C
EMMC16G-WW28	16GB	5.1 (HS400)	11.5x13x0.9	3D TLC	-40°C~+85°C
EMMC32G-IX29	32GB	5.1 (HS400)	11.5x13x0.8	3D TLC	-40°C~+85°C
EMMC64G-IY29	64GB	5.1 (HS400)	11.5x13x0.8	3D TLC	-40°C~+85°C
EMMC128-IY29	128GB	5.1 (HS400)	11.5x13x0.8	3D TLC	-40°C~+85°C
EMMC256-IY29	256GB	5.1 (HS400)	11.5x13x1.0	3D TLC	-40°C~+85°C

Automotive-Temp eMMC

P/N	Capacity	eMMC Stand	Package Size	NAND	Temperature
EMMC04G-AR0A	4GB	5.1 (HS400)	11.5x13x1.0	MLC	-40°C ~ +105°C
EMMC08G-AR0A	8GB	5.1 (HS400)	11.5x13x1.0	MLC	-40°C~+105°C

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